{"id":162,"date":"2020-01-17T14:36:46","date_gmt":"2020-01-17T05:36:46","guid":{"rendered":"https:\/\/www.iee.jp\/en\/?page_id=162"},"modified":"2024-12-27T13:30:25","modified_gmt":"2024-12-27T04:30:25","slug":"sitemap","status":"publish","type":"page","link":"https:\/\/www.iee.jp\/en\/sitemap\/","title":{"rendered":"English Sitemap"},"content":{"rendered":"\n<ul class=\"p-sitemap__group__list\">\n<li><a href=\"..\/..\/en\/about\/\">about IEEJ<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n<li><a href=\"..\/..\/en\/post\/greeting\/\">President&#8217;s Inaugural Address<\/a><\/li>\n<li><a href=\"..\/..\/en\/about\/overview\/\">Overview<\/a><\/li>\n<p>            <!--\n\n<li><a href=\"http:\/\/denki.iee.jp\/?page_id=1611\">Outline<\/a><\/li>\n\n\n            <li\"><a href=\"http:\/\/denki.iee.jp\/?page_id=10042\">Members of Board of Directors<\/a>\n        <\/li>\n\n--><\/p>\n<li><a href=\"..\/..\/en\/about\/code_ethics_en\/\">Code of Ethics<\/a><\/li>\n<li><a href=\"..\/..\/en\/about\/code_conduct_en\/\">Code of Conduct<\/a><\/li>\n<li><a href=\"..\/..\/en\/about\/secretariat\/\">Secretariat<\/a><\/li>\n<p>        <!--\n\n<li><a href=\"http:\/\/denki.iee.jp\/?page_id=6653\">Links<\/a>\n          \n\n<ul class=\"p-sitemap__group__list__child\">\n            \n\n<li><a href=\"http:\/\/denki.iee.jp\/?page_id=6653\">Institutes for Electrical, Information and Communication Engineers<\/a><\/li>\n\n\n            \n\n<li><a href=\"http:\/\/denki.iee.jp\/?page_id=6661\">Related Links<\/a><\/li>\n\n\n          <\/ul>\n\n\n        <\/li>\n\n-->\n      <\/ul>\n<li><a href=\"..\/..\/en\/enrollment\/individual_member\/\">Become a Member<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n<li><a href=\"..\/..\/en\/about\/system\/\">Membership<\/a><\/li>\n<li><a href=\"..\/..\/en\/enrollment\/individual_member\/\">Become a Member<\/a><\/li>\n<li><a href=\"..\/..\/en\/enrollment\/m_service\/\">Member Services<\/a><\/li>\n<\/ul>\n<\/li>\n<p>      <!--\n\n<li><a href=\"..\/..\/en\/enrollment\/individual_member\/\">Information<\/a><\/li>\n\n--><\/p>\n<li><a href=\"https:\/\/www.iee.jp\/event\/list\/\">Events<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n          <!--\n\n<li><a href=\"http:\/\/denki.iee.jp\/?page_id=7423\">Events Calendar<\/a><\/li>\n\n--><\/p>\n<li><a href=\"..\/..\/en\/event\/international_conf\/\">International Conference<\/a><\/li>\n<\/ul>\n<\/li>\n<li><a href=\"..\/..\/en\/pub\/journal\/\">Journal &#038; Paper<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n<li><a href=\"..\/..\/en\/pub\/journal\/\">Journal<\/a><\/li>\n<li><a href=\"..\/..\/en\/pub\/post\/\">Paper Submission<\/a><\/li>\n<li><a href=\"..\/..\/en\/pub\/guideline\/\">Author&#8217;s Guidelines<\/a><\/li>\n<\/ul>\n<\/li>\n<li><a href=\"https:\/\/www.iee.jp\/en\/pub\/\">Publications<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n<li><a href=\"..\/..\/en\/pub\/tech_report\/\">Abstract of Technical Report<\/a><\/li>\n<li><a href=\"..\/..\/en\/pub\/digital_library\/\">Digital Library<\/a><\/li>\n<\/ul>\n<\/li>\n<li><a href=\"..\/..\/en\/tech_mtg\/\">Technical Meetings<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n<li>\n            <a href=\"..\/..\/en\/tech_mtg\/overview\/\">Technical Meetings<\/a><\/p>\n<ul class=\"p-sitemap__group__list__child\">\n<li><a href=\"..\/..\/en\/tech_mtg\/overview\/\">Technical Meetings<\/a><\/li>\n<li><a href=\"..\/..\/en\/tech_mtg\/app\/\">How to Apply<\/a><\/li>\n<li><a href=\"..\/..\/en\/tech_mtg\/howto\/\">How to Prepare a Manuscript<\/a><\/li>\n<\/ul>\n<\/li>\n<p>          <!--\n\n<li>\n            <a href=\"http:\/\/denki.iee.jp\/?page_id=5925\">Committee<\/a>\n          <\/li>\n\n-->\n        <\/ul>\n<\/li>\n<li><a href=\"https:\/\/www.iee.jp\/en\/about\/secretariat\/\">Contacts Us<\/a> <\/li>\n<li><a href=\"https:\/\/www.iee.jp\/about\/department\/\">Technical Societies<\/a>\n<ul class=\"p-sitemap__group__list__child\">\n<li><a href=\"https:\/\/www.iee.jp\/en-fms\/\">Fundamentals and Materials<\/a><\/li>\n<li><a href=\"https:\/\/www.iee.jp\/en-pes\/\">Power and Energy<\/a><\/li>\n<li><a href=\"https:\/\/www.iee.jp\/en-eiss\/\">Electronics, Information and Systems Society<\/a><\/li>\n<li><a href=\"https:\/\/www.iee.jp\/en-ias\/\">Industry Applications<\/a><\/li>\n<li><a href=\"https:\/\/www.iee.jp\/en-smas\/\">Sensors and Micromachines<\/a><\/li>\n<\/ul>\n<\/li>\n<p>      <!--\n\n<li><a href=\"..\/..\/en\/sitemap\/\">Sitemap<\/a> <\/li>\n\n--><\/p>\n<li><a href=\"..\/..\/en\/privacypolicy\/\">Privacy Policy<\/a>\n      <\/li>\n<\/ul>\n<p>      <!--\n      \n\n<h3 class=\"p-heading-line\">Information<\/h3>\n\n\n      \n\n<ul class=\"p-sitemap__group__list\">\n        \n\n<li><a href=\"http:\/\/denki.iee.jp\/?p=18444\" title=\"Request for Copyright Transfer of International Symposium on Power Semiconductor Devices &#038; ICs\">Request for Copyright Transfer of International Symposium on Power Semiconductor Devices &#038; ICs (2018\/03\/27)<\/a> <\/li>\n\n\n        \n\n<li><a href=\"http:\/\/denki.iee.jp\/?p=13225\" title=\"The International Conference on Electrical Engineering 2016(ICEE2016\uff09\">The International Conference on Electrical Engineering 2016 (ICEE2016\uff09 (2015\/11\/12)<\/a> <\/li>\n\n\n        \n\n<li><a href=\"http:\/\/denki.iee.jp\/?p=1989\" title=\"The Electronic Journal Edition of IEEJ Transactions A, B, C, D &amp; E to be the Main Edition and the Publishing Fee to be Reduced\">The Electronic Journal Edition of IEEJ Transactions A, B, C, D &amp; E to be the Main Edition and the Publishing Fee to be Reduced (2013\/10\/01)<\/a> <\/li>\n\n\n      <\/ul>\n\n --><\/p>\n","protected":false},"excerpt":{"rendered":"<p>about IEEJ President&#8217;s Inaugural Address Overview Code of Ethics Code of Conduct Secretariat Become a Me [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false},"class_list":["post-162","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/pages\/162","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/comments?post=162"}],"version-history":[{"count":5,"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/pages\/162\/revisions"}],"predecessor-version":[{"id":503,"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/pages\/162\/revisions\/503"}],"wp:attachment":[{"href":"https:\/\/www.iee.jp\/en\/wp-json\/wp\/v2\/media?parent=162"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}