{"id":534,"date":"2019-12-09T15:52:29","date_gmt":"2019-12-09T06:52:29","guid":{"rendered":"https:\/\/www.iee.jp\/ias\/?page_id=534"},"modified":"2021-09-09T10:52:08","modified_gmt":"2021-09-09T01:52:08","slug":"tools","status":"publish","type":"page","link":"https:\/\/www.iee.jp\/ias\/tools\/","title":{"rendered":"\u304a\u5f79\u7acb\u3061\u30c4\u30fc\u30eb"},"content":{"rendered":"<p><img loading=\"lazy\" decoding=\"async\" width=\"980\" height=\"1362\" data-attachment-id=\"549\" data-permalink=\"https:\/\/www.iee.jp\/ias\/tools\/pc\/\" data-orig-file=\"https:\/\/www.iee.jp\/ias\/wp-content\/uploads\/sites\/5\/2019\/12\/pc.jpg\" data-orig-size=\"980,1362\" data-comments-opened=\"1\" data-image-meta=\"{&quot;aperture&quot;:&quot;0&quot;,&quot;credit&quot;:&quot;&quot;,&quot;camera&quot;:&quot;&quot;,&quot;caption&quot;:&quot;&quot;,&quot;created_timestamp&quot;:&quot;0&quot;,&quot;copyright&quot;:&quot;&quot;,&quot;focal_length&quot;:&quot;0&quot;,&quot;iso&quot;:&quot;0&quot;,&quot;shutter_speed&quot;:&quot;0&quot;,&quot;title&quot;:&quot;&quot;,&quot;orientation&quot;:&quot;0&quot;}\" data-image-title=\"pc\" data-image-description=\"\" data-image-caption=\"\" data-medium-file=\"https:\/\/www.iee.jp\/ias\/wp-content\/uploads\/sites\/5\/2019\/12\/pc-216x300.jpg\" data-large-file=\"https:\/\/www.iee.jp\/ias\/wp-content\/uploads\/sites\/5\/2019\/12\/pc-737x1024.jpg\" class=\"alignnone size-full wp-image-549 u-hidden-sp u-block-center u-block\" style=\"width: 980px\" src=\"https:\/\/www.iee.jp\/ias\/wp-content\/uploads\/sites\/5\/2021\/09\/pc.jpg\" alt=\"\u304a\u5f79\u7acb\u3061\u30c4\u30fc\u30eb\" usemap=\"#ImageMap\" \/><\/p>\n<map name=\"ImageMap\">\n<area alt=\"\u6771\u829d\" coords=\"463,64,596,107\" shape=\"rect\" href=\"https:\/\/toshiba.semicon-storage.com\/jp\/semiconductor\/design-development\/simulation.html\" target=\"_blank\" \/>\n<area alt=\"\u5bcc\u58eb\u96fb\u6a5f\" coords=\"465,133,596,177\" shape=\"rect\" href=\"https:\/\/www.fujielectric.co.jp\/products\/semiconductor\/model\/igbt\/simulation\/\" target=\"_blank\" \/>\n<area alt=\"\u4e09\u83f1\u96fb\u6a5f\" coords=\"464,202,595,245\" shape=\"rect\" href=\"http:\/\/www.mitsubishielectric.co.jp\/semiconductors\/simulator\/index.html\" target=\"_blank\" \/>\n<area alt=\"JSOL\" coords=\"678,314,808,357\" shape=\"rect\" href=\"https:\/\/www.jmag-international.com\/jp\/\" target=\"_blank\" \/>\n<area alt=\"\u5c0f\u5009\u30af\u30e9\u30c3\u30c1\" coords=\"835,316,969,359\" shape=\"rect\" href=\"https:\/\/www.oguraclutch.co.jp\/helpful\/helpful-qa\/\" target=\"_blank\" \/>\n<area alt=\"RFDN\" coords=\"490,937,624,982\" shape=\"rect\" href=\"http:\/\/gate.ruru.ne.jp\/rfdn\/index.htm\" target=\"_blank\" \/>\n<area alt=\"CASIO\" coords=\"487,1107,622,1152\" shape=\"rect\" href=\"https:\/\/keisan.casio.jp\/\" target=\"_blank\" \/>\n<area alt=\"PESim\" coords=\"460,1230,960,1340\" shape=\"rect\" href=\"http:\/\/www2.iee.or.jp\/~dspc\/PESim\/index.html\" target=\"_blank\" \/>\n <\/map>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"jetpack_post_was_ever_published":false},"class_list":["post-534","page","type-page","status-publish","hentry"],"acf":[],"jetpack_sharing_enabled":true,"jetpack_shortlink":"https:\/\/wp.me\/PbExjQ-8C","jetpack-related-posts":[],"_links":{"self":[{"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/pages\/534","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/comments?post=534"}],"version-history":[{"count":6,"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/pages\/534\/revisions"}],"predecessor-version":[{"id":2101,"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/pages\/534\/revisions\/2101"}],"wp:attachment":[{"href":"https:\/\/www.iee.jp\/ias\/wp-json\/wp\/v2\/media?parent=534"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}