{"id":925,"date":"2023-01-01T17:15:05","date_gmt":"2023-01-01T08:15:05","guid":{"rendered":"https:\/\/www.iee.jp\/smas\/?p=925"},"modified":"2025-02-25T10:37:03","modified_gmt":"2025-02-25T01:37:03","slug":"20230101-2","status":"publish","type":"post","link":"https:\/\/www.iee.jp\/smas\/20230101-2\/","title":{"rendered":"\u82f1\u8a9e\u8ad6\u6587\u7279\u96c6\u512a\u79c0\u8ad6\u6587\u8cde"},"content":{"rendered":"<p>2023\u5e74143\u5dfb1\u53f7\u306e\u300c\u7279\u96c6\uff1a\u30bb\u30f3\u30b5\u30fb\u30de\u30a4\u30af\u30ed\u30de\u30b7\u30f3\u82f1\u6587\u7279\u96c6\u53f7\u300d\u3067\u306f\uff0c\u8ad6\u6587\u59d4\u54e1\u4f1a\u5e79\u4e8b\u56e3\u306b\u3088\u308b\u53b3\u6b63\u306a\u5be9\u67fb\u306e\u7d50\u679c\uff0c<br \/>\nTomoya Imanishi, Keiju Miyamoto, Shuntaro Higashi, Shunsuke Oki, Akio Uesugi, Koji Sugano, Takanori Aono, Yoshitada Isono<br \/>\n&#8220;Fabrication of Tri-Axial MEMS Tactile Sensor for Minimally Invasive Medical Application using Wafer-Level Packaging&#8221;<br \/>\n\u3092\u82f1\u8a9e\u8ad6\u6587\u7279\u96c6\u512a\u79c0\u8ad6\u6587\u8cde\u3068\u3057\u3066\u8868\u5f70\u3059\u308b\u3053\u3068\u306b\u306a\u308a\u307e\u3057\u305f\u3002<\/p>\n<p><a href=\"https:\/\/www.jstage.jst.go.jp\/article\/ieejsmas\/143\/1\/143_13\/_article\/-char\/ja\" rel=\"noopener\" target=\"_blank\">https:\/\/www.jstage.jst.go.jp\/article\/ieejsmas\/143\/1\/143_13\/_article\/-char\/ja<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>2023\u5e74143\u5dfb1\u53f7\u306e\u300c\u7279\u96c6\uff1a\u30bb\u30f3\u30b5\u30fb\u30de\u30a4\u30af\u30ed\u30de\u30b7\u30f3\u82f1\u6587\u7279\u96c6\u53f7\u300d\u3067\u306f\uff0c\u8ad6\u6587\u59d4\u54e1\u4f1a\u5e79\u4e8b\u56e3\u306b\u3088\u308b\u53b3\u6b63\u306a\u5be9\u67fb\u306e\u7d50\u679c\uff0c Tomoya Imanishi, Keiju Miyamoto, Shuntaro Higashi, Sh [&hellip;]<\/p>\n","protected":false},"author":34,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"jetpack_post_was_ever_published":false,"_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_memberships_contains_paid_content":false,"jetpack_publicize_message":"","jetpack_publicize_feature_enabled":true,"jetpack_social_post_already_shared":true,"jetpack_social_options":{"image_generator_settings":{"template":"highway","default_image_id":0,"font":"","enabled":false},"version":2}},"categories":[8],"tags":[],"class_list":["post-925","post","type-post","status-publish","format-standard","hentry","category-news"],"acf":[],"jetpack_publicize_connections":[],"jetpack_featured_media_url":"","jetpack_sharing_enabled":true,"jetpack_shortlink":"https:\/\/wp.me\/pbExl9-eV","jetpack-related-posts":[],"_links":{"self":[{"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/posts\/925","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/users\/34"}],"replies":[{"embeddable":true,"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/comments?post=925"}],"version-history":[{"count":2,"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/posts\/925\/revisions"}],"predecessor-version":[{"id":927,"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/posts\/925\/revisions\/927"}],"wp:attachment":[{"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/media?parent=925"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/categories?post=925"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.iee.jp\/smas\/wp-json\/wp\/v2\/tags?post=925"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}