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<div id="wrapper"><table width="700" border="1" align="center">  <tr>       <td bgcolor="#CCCCFF" class="title">OS3-4　Effect of various buffering agents on the electrodeposited nickel and Ni-P alloy plating film</td>     </tr>     <tr>       <td class="chosha">◎Masayoshi Terada（Rough Neck），Keita Sato，Yoshiaki Ouya，Tsugito Yamashita（Kanto Gakuin University）</td>     </tr>     <tr>       <td class="abst">Investigated Boron-Free alternative buffer agents for nickel plating. <br> The electrochemical properties of electrodeposited nickel film with various buffer agents such as Phthalic acid bath, Potassium hydrogen phthalate bath and Malic acid bath were structurally analyzed and evaluated, and compared with those of Citric acid and Watts bath. And Electrolytic Ni-P alloy plating bath using above buffer agents Ni-P alloy plating film was prepared to examine the effects also.<br> The evaluation and analysis of various buffer agents in nickel bath containing carboxyl group buffers was confirmed that it has suppressing effect to electro deposition. It also showed electro crystallization inhibitory effect and possibility of refining the crystal.</td>     </tr> </table></div>
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