| 3-D hetero-integration have many benefits such as increased multi-functionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, because it vertically stacks multiple materials, technologies, and functional components into one stacked chip. It can create many potential applications such as innovative convergence systems because it allows the assembling various kinds of functional blocks. However, hetero-integration of different functional devices has many technical challenges owing to various types of size, thickness, and substrate of different functional devices. This paper introduce 3-D hetero-integration technologies for multi-functional hetero-integrated convergence systems developed by Tohoku Univ./GINTI. |